The SySTIUM® Blog

News and announcements about SySTIUM®, including our products, service, staff and our industry.

  • SySTIUM® installed a new Cincinnati Proform+ Press Brake in December 2013, bringing metal forming operations in house. This expenditure will improve our production lead times and also help us in controlling product fabrication cost. Metal forming is required on all SySTIUM® Express Enclosure Solutions.  Having this capability in house will also greatly reduce the time to produce prototypes and first articles. Here are some pictures of the installation of the 19,200 lb. Brake Press: Read More
    Tags: Company News
  • End of Life Notification Products Affected by this EOL: The 10648-00 (430W) Power Supply and all products that use the 10648-00 Power Supply Dear SySTIUM® Customer,  This letter is to announce the discontinuance of SySTIUM® part number 10648-00, a 430W power supply and all standard and custom products that use this power supply.  Read More
    Tags: Product News
  • Products Affected by this EOL: The 10635-00, 10635-01 (350W) Power Supply and all products that use the 10635-00 and 10635-01 Power Supply Standard Products Affected:  See Appendix I Custom Products Affected: Specific customers will be notified by SySTIUM® or the integrator of the custom product.         Dear SySTIUM® Customer, Read More
    Tags: Product News
  • SySTIUM® has developed the EE-250 to work with recently announced Intel® D33217GK, nicknamed the NUC. The EE-250 Express Enclosure™ design can be altered to accommodate any customer need. The Intel® board uses the latest generation of Intel® Core™ processor technology, Core i3-3217U, Ivy Bridge. The EE-250 is quiet and easily mounted behind an LCD for a media content player. SySTIUM® prides itself on creating unique enclosures- this unit can be painted in any color you can imagine. Stay tuned for more updates on the EE-250.  Read More
  • The SySTIUM® EE-130 preproduction units are shipping. The EE-130 is a small form factor, embedded Express Enclosure solution designed to accommodate the new generation of low profile mini-ITX motherboards that utilize the latest generation of Intel® Core™ processor technology.  The EE-130 Prototype ships with a mounting plate designed to mount the EE-130 to a Vesa mount. Initial motherboard validation has been done using the Intel® DH61AG and Intel® DQ77KB mini-ITX motherboards with the Intel® supplied low profile blower heatsink.  Read More
  • SySTIUM® personnel will be participating in the Intel® Developer Forum Intel Developer Forum at the Moscone Center West, San Francisco, California on September 11–13, 2012. Contact SySTIUM® to schedule face to face meetings at the forum.   Read More
  • SySTIUM® Express Enclosure™ solutions are pre-designed technology enclosures that are easily modified to be customer specific and application ready. Since 1997 SySTIUM® has built a large portfolio of pre-designed technology enclosures that fit a wide variety of applications. These pre-designed enclosures can be used as designed or quickly modified by SySTIUM® to fit your specific application requirements or to meet the specifications and thermal requirements of the components required by the application. Read More
  • The Intel® DN2800MT is a very versatile, cost effective motherboard building block that is applicable to many embedded / applied computing applications.   Read More
  • Model 555, early image- front panel I/O demo only- actual only USB
    The SySTIUM® Model 555 is the replacement for our Model 545 product line. After 12 years of production the Model 545 went end of life in 2011.  Like the Model 545 the Model 555 is also a long life MotherBoard Ready™ ATX platform that will support a wide variety of validated  and certified motherboards from the industry's leading suppliers.  The 555 will be available in Black and Cool Gray (same as our Model 526) Although almost identical in size to the Model 545, the Model 555 will support a more flexible mix of add-in peripherals. Read More
  • heat sink
    SySTIUM® Technologies is a supplier of long life microprocessor heatsinks for a variety of applications. Read More
    Tags: Product News
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