Express Enclosure™ Solutions

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  • SySTIUM® has developed the EE-250 to work with recently announced Intel® D33217GK, nicknamed the NUC. The EE-250 Express Enclosure™ design can be altered to accommodate any customer need. The Intel® board uses the latest generation of Intel® Core™ processor technology, Core i3-3217U, Ivy Bridge. The EE-250 is quiet and easily mounted behind an LCD for a media content player. SySTIUM® prides itself on creating unique enclosures- this unit can be painted in any color you can imagine. Stay tuned for more updates on the EE-250.  Read More
  • The SySTIUM® EE-130 preproduction units are shipping. The EE-130 is a small form factor, embedded Express Enclosure solution designed to accommodate the new generation of low profile mini-ITX motherboards that utilize the latest generation of Intel® Core™ processor technology.  The EE-130 Prototype ships with a mounting plate designed to mount the EE-130 to a Vesa mount. Initial motherboard validation has been done using the Intel® DH61AG and Intel® DQ77KB mini-ITX motherboards with the Intel® supplied low profile blower heatsink.  Read More
  • SySTIUM® Express Enclosure™ solutions are pre-designed technology enclosures that are easily modified to be customer specific and application ready. Since 1997 SySTIUM® has built a large portfolio of pre-designed technology enclosures that fit a wide variety of applications. These pre-designed enclosures can be used as designed or quickly modified by SySTIUM® to fit your specific application requirements or to meet the specifications and thermal requirements of the components required by the application. Read More
  • The Intel® DN2800MT is a very versatile, cost effective motherboard building block that is applicable to many embedded / applied computing applications.   Read More
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